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Semiconductor Ceramics

Semiconductor Ceramics | Plasma-Resistant Alumina & Yttria Parts

Semiconductor Ceramics: Precision Components for Wafer Processing & Etch Equipment


Semiconductor manufacturing tolerates almost no contamination and almost no dimensional drift. A single micron of wear on a wafer chuck, or a chemical reaction between a chamber component and plasma, can scrap an entire production run. That's why fabs specify ceramics — specifically high-purity alumina, yttria-stabilized zirconia, and aluminum nitride — for the parts that sit inside etch chambers, CVD/PVD tooling, and wafer-handling systems.


We machine these components to the tolerances semiconductor equipment OEMs and fabs require, from prototype quantities through production runs.


Where these parts are used ?

  • Etch chamber liners, rings, and nozzles exposed to fluorine/chlorine-based plasma

  • Wafer chucks and end-effectors for handling and transport

  • Insulating standoffs and feedthroughs in high-voltage RF equipment

  • Susceptors and heater plates for CVD/epitaxial processes

  • Electrostatic chuck (ESC) components


Why ceramics over metal or PEEK here ?

Metals corrode or sputter under plasma exposure, introducing metal contamination into the chamber. PEEK and other polymers can't survive chamber bake-out temperatures. Semiconductor-grade ceramics solve both problems: they're chemically inert to most process gases, dimensionally stable across repeated thermal cycling, and won't outgas under vacuum.


Materials we work in.

Material

Why it's chosen for semiconductor applications

High-purity Alumina (Al₂O₃, 99.5%+)

Baseline dielectric insulator, cost-effective, good machinability

Yttria-Stabilized Zirconia (YSZ)

Superior plasma/etch resistance vs. alumina in fluorine chemistry

Aluminum Nitride (AlN)

High thermal conductivity — used where heat must be dissipated through the insulator

Silicon Nitride (Si₃N₄)

High mechanical strength where thermal shock resistance matters

 Specifications

Property

Typical Range

Purity (Alumina)

95%–99.7%

Dimensional tolerance

±0.01–0.03 mm (confirm your tightest demonstrated tolerance)

Surface finish

Ra 0.2–0.8 μm (confirm your standard vs. optical-grade finish)

Max working temperature

Up to 1400°C (confirm per material)

Dielectric strength

Confirm test standard used (ASTM D149 or equivalent)


Upload your drawing or spec sheet for a technical review → [Request RFQ] FAQs

1: What are semiconductor ceramics? They are advanced ceramics with excellent electrical insulation and thermal properties used in semiconductor and electronics manufacturing.


Q2: Are these ceramics suitable for high-power applications? Yes, they perform extremely well in high-power, high-temperature conditions.


Q3: Can I order custom sizes? Yes, full customization is available for thickness, shapes, holes, and tolerances.


Q4: What materials do you offer? Alumina, zirconia, silicon nitride, and other advanced ceramic composites.

  • Product details

    Type:Semiconductor Industry

    Material:99.5%Alumina Ceramics

    Shape:Customized Designs

    Surface Roughness:Ra 0.6μm

    Torlerance:+-0.01mm

    Application Field:Industrial Ceramic

    Processing Service:tooling,pressing,sintering,grinding,assembling,QC inspection

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